產品展示
- 層數:12層
Number of layers: 12 layers
板厚:3.6mm
Thickness:3.6mm
最小孔徑:0.6mm
Min. Hole:0.6mm
材料:RO4350
Base Material:RO4350
技術特點:高頻、高可靠性、壓接孔、背鉆
Technical Feature:High frequency,high reliability,press fit, backdrill
- 層數:4層
Numberoflayers:4layers
板厚:35mm
Thickness: 3.5mm
最小孔徑:0.6mm
Min.hole:0.6mm
材料:RT5880
Base material: RT5880
技術特點:混壓、階梯槽、埋孔
Technical Feature: Mix lamination,step slot, buried hole
- 層數:4層
Numberoflayers:4layers
板厚:18mm
Thickness:1.8mm
最小孔徑:1.0mm
Min. hole: 1.0mm
材料:RO4534
Base material:RO4534
技術特點:FR-4與陶瓷基板混壓
Technical Feature: Mix lamination of FR-4 and ceramic material
- 層數:4層
Numberof layers:4layers
板厚:16mm
Thickness:1.6mm
最小孔徑:06mm
Min.hole:0.6mm
材料:TLC-32+FR-28
Base material:TLC-32+FR-28
技術特點:高頻、高可靠性
Technical Feature:High frequency,highreliability