產品展示
- 層數:1層
Numberoflayers:1layer
板厚:1.5mm
Thickness:1.5mm
最小孔徑:0.8m
Min. hole:0.8mm
材料:1mm銅基+0.5mmPTFE材料
Base material: 1mm Copper Based
Material+0.5mm PTFEMaterial
技術特點:散熱、高頻
Technical Feature: Heat dissipation, high frequency
- 層數:1層
Numberof layers:1layer
板厚:53mm
Thickness: 5.3mm
最小孔徑:0.5mm
Min.hole:0.5mm
材料:鋁基板+PTFE
Base material: Aluminum Based Material+PTFEMaterial
技術特點:錫膏壓焊、高頻、散熱
Technical Feature: Solder paste pressure elding,high frequency, heat dissipation
- 層數:1層
Numberof layers:1layer
板厚:125mr
Thickness:1.25mm
最小孔徑:20mm
Min. hole: 2.0mm
材料:1mm銅基+0.25mmPTFE材料
Base material: lmm Copper Based
Material+0.25mmPTFEMaterial
技術特點:散熱、高頻
Technical Feature : Heat dissipation, high frequency
- 層數:1層
Number of layers: 1 layer
板厚:53mm
Thickness:5.3mm
最小孔徑:3.0mm
Min.hole:3.0mm
材料:鋁基板+PTFE
Base material: Aluminum Based Material
+PTFEMaterial
技術特點:散熱、高頻、階梯
TechnicalFeature:Heatdissipation,high frequency,step
- 層數:2層
Numberof layers:2layers
板厚:40mm
Thickness:4.0mm
最小孔徑:0.8mm
Min. hole size:0.8mm
材料:銅基板+PTFE
Base material: Copper Base+PTFE
技術特點:錫箔壓焊、高散熱、高頻
TechnicalFeature:Tinfoil pressure welding superior heat dissipation,high frequency
- 層數:1層
Numberof layers:1layer
板厚:1.0mm
Thickness:1.0mm
最小孔徑:30mm
Min. hole: 3.0mr
材料:鋁基板+復合陶瓷
Base material: Aluminum Based Material
+Composite Ceramic Material
技術特點:高散熱
TechnicalFeature:Superior heat
dissipation
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