產品展示
- 層數:4層
Number of layers:4layers
板厚:10mm
Thickness:1.0mm
最小孔徑:0.4mm
Min.hole:0.4mm
材料:RO4350+FR-4
Base material:RO4350+FR-4
技術特點:盲孔、混壓
Technical Feature: Blind hole, mix lamination
- 層數:4層
Number of layers: 4 layers
板厚:06mm
Thickness:0.6mm
最小孔徑:0.3mm
Min.hole:0.3mm
材料: TSM-DS3+FR-28
Base material: TSM-DS3+FR-28
技術特點:內層埋平面電阻、階梯
Technical Feature: Planar embedded resistor in inner layer, step
- 層數:4層
Number of layers:4layers
板厚:1.0mm
Thickness:1.0mm
最小孔徑:0.3mm
Min.hole:0.3mm
材料:F4B+FR-4
Base material:F4B+FR-4
技術特點:階梯、可立體安裝
Technical Feature: Step, vertical assembly
- 層數:2層
Number of layers: 2 layers
板厚:0508m
Thickness: 0.508mr
最小孔徑:0.8mm
Min. hole size: 0.8mr
材料:RT6010
Base mateial:RT6010
技術特點:高精度
TechnicalFeature:High precision