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首頁 > 萬正電子 > 產品展示
產品展示
層數:3層
Number of layers:3layers
板厚:2.2mm
Thickness:2.2mm
最小孔徑:12m
Min. hole:1.2mm
材料:RT5880
Base material: RT5880
技術特點:混壓、階梯
Technical Feature:Mixlamination,step
層數:8層
Number of layers: 8 layers
板厚:36mm
Thickness:3.6mm
最小孔徑:0.6mm
Min.hole:0.6mm
材料:Dicla880
Base material: Diclad880
技術特點:混壓、多層階梯、鍍厚金
Technical Feature:Mix lamination，multi-step, thick gold plating
層數:2層
Numberof layers:2layers
板厚:1.0mm
Thickness:1.0mm
最小孔徑:0.8mm
Min. hole:0.8mm
材料:TLY-5
Base material:TLY-5
技術特點:階梯槽
Technical Feature: Step slot
層數:3層
Number of layers:3 layers
板厚:32mm
Thickness:3.2mm
最小孔徑:3.0mm
Min.hole:3.0mm
材料:RO4350
Base material:RO4350
技術特點:混壓、階梯
TechnicalFeature:Mix lamination,step
層數:2層
Number of layers: 2 layers
板厚:5.0mm
Thickness:5.0mm
最小孔徑:10mn
Min . hole: 1.0mm
材料:RO4003
Base~material:RO4003
技術特點:混壓、超厚
Technical Feature: Mix lamination，super-thick
層數:6層
Number of layers:6layers
板厚:30mm
Thickness:30mm
材料:聚酰亞胺發泡材料
Base material: Polyimide Foaming Material
技術特點:聚酰亞胺發泡材料與PTFE混壓、
超厚、超大版面
Technical Feature: Mix lamination of
polyimide foaming material and PTFE,
super-thick,large panel
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